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Surface morphological study of SILAR grown Ag2S thin films

Citation

Kakade, B. N. (2026). Surface morphological study of SILAR grown Ag2S thin films. International Journal of Research, 13(13), 738–746. https://doi.org/10.26643/rb.v118i9.7971

 B. N. Kakade

Late R D Deore Art's and Science College,Mhasdi, Dist.-Dhule, Pin-424304

 

Abstract

Silver sulfide (Ag₂S) thin films were deposited on glass substrates using the successive ionic layer adsorption and reaction (SILAR) technique, and their surface morphology was systematically investigated using atomic force microscopy (AFM). The AFM analysis revealed uniform and compact surface features with well-distributed grains across the substrate, indicating homogeneous film growth achieved through the SILAR process. Quantitative surface parameters such as average roughness (Ra), root mean square roughness (Rq), and grain size were evaluated as a function of the number of SILAR cycles. The results showed that surface roughness and grain size increased gradually with increasing deposition cycles, reflecting progressive nucleation and coalescence of Ag₂S nanocrystallites. Three-dimensional AFM images confirmed the formation of densely packed grains with good surface coverage and minimal voids. The observed surface morphology suggests improved film continuity and adhesion, which are desirable for optoelectronic and sensing applications. This study demonstrates that AFM is an effective tool for understanding the growth mechanism and surface evolution of SILAR-grown Ag₂S thin films.

Key words: Ag2S thin films, AFM, SILAR

 

 

 

 

 

 

 

Introduction

Among metal sulphide semiconductors, silver sulphide (Ag₂S) has been extensively investigated owing to its potential applications in infrared (IR) detectors, photoconducting devices, solar selective coatings, photovoltaic cells, and photosensitive recording media [1,2]. This sustained interest is mainly attributed to its favorable intrinsic properties, including non-toxicity, strong absorption in the near-infrared region, good chemical stability against moisture, and process-dependent electrical conductivity [3–5]. Furthermore, Ag₂S exhibits a wide band gap range, from approximately 1.0 eV for indirect transitions to about 2.3 eV for direct transitions [6], making it suitable for optoelectronic, photovoltaic, and photoelectrochemical applications [7]. The relevance of Ag₂S has been further reinforced by recent reports on electrochemical photovoltaic storage cells employing Ag₂S electrodes [8].

The physical properties of Ag₂S thin films are strongly influenced by the deposition technique and growth conditions, particularly film thickness, crystallinity, and surface morphology. Various physical and chemical methods have been reported for the fabrication of Ag₂S thin films, including molecular beam epitaxy [9], thermal co-evaporation [10], physical vacuum deposition [11], aerosol-assisted chemical vapor deposition [12], sequential thermal evaporation [13], chemical bath deposition (CBD) [15,16], solution growth techniques [4], successive ionic layer adsorption and reaction (SILAR) [17,18], thermal evaporation [19], and spray pyrolysis [6]. Although vacuum-based techniques can yield films with high crystalline quality, their high cost, complex instrumentation, and limited scalability restrict their use for large-area and low-cost device fabrication.

Solution-based techniques such as CBD and SILAR have therefore gained significant attention due to their simplicity and economic viability. However, CBD often suffers from limitations such as poor control over film thickness, non-uniform nucleation, and precursor wastage. In contrast, the SILAR technique offers improved control over film growth through sequential and self-limiting surface reactions, allowing precise tuning of thickness and microstructure by varying the number of deposition cycles. Additionally, SILAR does not require vacuum conditions or high-quality substrates, making it particularly suitable for large-area and industrial-scale applications.

Surface morphology plays a crucial role in determining the optical and electrical performance of Ag₂S thin films, especially for device-oriented applications. Atomic force microscopy (AFM) has been widely employed to investigate surface roughness, grain size distribution, and film uniformity in Ag₂S thin films deposited by various chemical routes [20–23]. Previous AFM studies have demonstrated that the surface morphology of Ag₂S films is highly sensitive to deposition parameters, influencing grain coalescence, roughness evolution, and film continuity. However, despite these reports, systematic investigations correlating SILAR deposition cycles with surface morphological evolution remain limited.

The objective of the present study is to investigate the surface morphological evolution of Ag₂S thin films deposited by the SILAR technique using atomic force microscopy, with particular emphasis on understanding the influence of deposition cycles on film growth behavior.

Experimental Details

Ag₂S thin films were deposited using the successive ionic layer adsorption and reaction (SILAR) technique at room temperature. The SILAR process involves alternate immersion of the substrate in cationic and anionic precursor solutions, with intermediate rinsing steps to remove loosely bound ions and prevent homogeneous precipitation.

For the deposition of Ag₂S thin films, an aqueous silver nitrate (AgNO₃) solution was used as the cationic precursor, while thiourea solution served as the anionic precursor. Aqueous ammonia was added to the silver nitrate solution to form a stable silver–ammonia complex, thereby controlling the release of Ag⁺ ions during deposition.

A single SILAR cycle consisted of the following steps:

1.      Cationic adsorption: The cleaned glass substrate was immersed in the cationic precursor solution containing the [Ag(NH₃)₂]⁺ complex for 20 s, allowing adsorption of Ag⁺ ions onto the substrate surface.

  1. First rinsing: The substrate was removed from the cationic solution and rinsed in double-distilled water for 10 s to eliminate weakly adsorbed or excess Ag⁺ ions.
  2. Anionic reaction: The substrate was then immersed in the anionic precursor solution containing thiourea for 20 s, where the adsorbed Ag⁺ ions reacted with S²⁻ ions released from thiourea, leading to the formation of Ag₂S on the substrate surface.
  3. Second rinsing:After anionic immersion, the substrate was again rinsed in double-distilled water for 10 s to remove unreacted species and by-products.

This sequence constituted one complete SILAR deposition cycle. The desired film thickness was achieved by repeating the SILAR cycle for a predetermined number of cycles. After completion of deposition, the films were dried in air under ambient conditions. No post-deposition annealing was performed unless otherwise specified. Figure 1 shows the schematic representation of SILAR deposition cycle of Ag2S thin film preparation.

 

 

 

 

 

 

 

 

 

 


Result and Discussion

The surface morphology of the Ag₂S thin film deposited by the SILAR technique was investigated using atomic force microscopy. Figure 2(a) shows the two-dimensional (2D) AFM image, while Figure 2 (b) presents the corresponding three-dimensional (3D) topographical image of the Ag₂S thin film synthesized with 50 SILAR growth cycles over a scan area of 5 μm × 5 μm.

The 2D AFM image (Figure 2(a)) reveals a uniformly distributed granular surface morphology with well-defined grains covering the entire substrate. The absence of exposed substrate regions indicates continuous film formation and effective surface coverage. The grains appear to be nearly spherical and closely packed, suggesting homogeneous nucleation and growth during successive SILAR cycles. A few brighter regions with higher contrast are observed, which may be attributed to localized grain agglomeration or enhanced vertical growth at specific nucleation sites.

The 3D AFM image (Figure 2(b)) provides further insight into the surface topography of the Ag₂S thin film. The height profile confirms the presence of uniformly distributed surface protrusions corresponding to Ag₂S grains. The maximum height variation observed across the scanned area is approximately 0.57 μm, indicating moderate surface roughness. The gradual variation in height, rather than abrupt spikes, suggests controlled growth kinetics during the SILAR process. The absence of deep valleys or pinholes further confirms the compact nature of the film.

The observed granular morphology can be attributed to the layer-by-layer growth mechanism inherent to the SILAR technique. During each deposition cycle, Ag⁺ ions are adsorbed onto the substrate surface and subsequently react with S²⁻ ions to form Ag₂S. With increasing number of SILAR cycles, newly formed Ag₂S nuclei preferentially grow on existing grains, leading to grain coalescence and vertical growth. This results in a dense and uniform nanostructured surface, as observed in the AFM images.

The relatively uniform grain distribution and moderate surface roughness are desirable characteristics for optoelectronic and sensing applications, as surface morphology plays a crucial role in charge transport, optical absorption, and interfacial properties. Excessive roughness can lead to increased scattering and recombination losses, whereas a compact granular morphology enhances electrical connectivity and film stability.

Overall, the AFM analysis confirms that the SILAR method enables controlled growth of Ag₂S thin films with uniform surface morphology and good film continuity. The results demonstrate that Ag₂S thin films deposited with 50 SILAR cycles possess favorable surface characteristics, making them suitable for applications such as infrared detectors, photoconducting devices, and photovoltaic systems.

Figure 2 (a) 2-D, (b) 3-D AFM images of Ag2S thin film synthesized with 50 SILAR growth cycles.

 

(a)

(b)

 

 

 

 

 

 

 

 

 

 

 

 

 


Conclusions

Ag₂S thin films were successfully deposited on glass substrates using the SILAR technique under ambient conditions. Atomic force microscopy revealed a uniform, compact granular surface with complete substrate coverage and moderate roughness, indicating controlled and homogeneous film growth. The observed morphology suggests a layer-by-layer growth mechanism with grain coalescence occurring during successive SILAR cycles. These results demonstrate that SILAR is an effective, low-cost, and scalable method for tailoring the surface morphology of Ag₂S thin films, making them suitable for optoelectronic and infrared device applications.

 

Acknowledgement

Author is thankful to Principal Dr. S. B. Girase, Late R D Deore Art's and Science College, Mhasdi for supporting my research work. Author is also thankful to Dr. S. R. Gosavi for his valuable guidance.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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